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Laser die-cutting machine - the flexible packaging layer cutting process you never knew(I)
2024-07-15 14:04:06
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[abstract] Laser die-cutting machine - the flexible packaging layer cutting process you have never known. Here we mainly talk about the flexible packaging items that can be seen everywhere in the market. Almost all flexible packaging films are structures made of mul

Laser die-cutting machine - the flexible packaging layer cutting process you have never known. Here we mainly talk about the flexible packaging items that can be seen everywhere in the market. Almost all flexible packaging films are structures made of multiple layers of films. The thickness of each layer of film is about more than 10 microns, and each layer has different functions, such as PET has high rigidity and good confidentiality; PE has good heat sealing and strong tear resistance; PP has good water vapor barrier performance; aluminum foil is often used for light blocking seals; paper can usually provide good protection for the film. This also tests the layer cutting process technology of the laser die-cutting machine.

Laser layer cutting refers to selectively cutting a certain film layer without affecting the functions of other film layers. For example, micro-cutting a high-strength film layer can form an easy-to-open structure, but because the cut is very small, it does not affect the appearance of the package.

Although the method of mechanical scratching or mechanical punching of plastic film is fast and quite simple, neither method can distinguish different film layers. The results of mechanical scratching or mechanical punching are:

① If the scratch depth is too small, even the mechanical layer of the film is not completely cut;

② If the scratch depth is too large, the light-blocking layer and the water vapor barrier layer are destroyed.

Therefore, people have been pursuing a reliable processing technology to make cutting more precise and selective, and can choose to cut on different plastic film layers, and all of these are achieved by laser die-cutting machines.


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