PI film laser cutting/punching process is a very common processing method

The world's high-quality thin film insulation material PI film, known as the "golden film", is made of pyromellitic dianhydride (PMDA) and diaminodiphenyl ether (DDE) in a strong polar solvent to form an imine in a strong polar solvent.

PI film is used everywhere: space technology, F, H insulation motors, electrical appliances, FPC (flexible printed circuit boards), PTC electric heating films, TAB (pressure-sensitive adhesive tape substrates), aerospace, aerospace, computers, electromagnetic wires, transformers, audio, mobile phones, computers, smelting, mining electronic components, automobiles, transportation, atomic energy industry and other electronic and electrical industries. Semiconductor and microelectronics industry: passivation layer and buffer inner coating of microelectronic equipment, dielectric materials between layers of multi-layer metal interconnect circuits, and important substrates for optoelectronic printed circuit boards.

High-end materials are naturally inseparable from high-end industrial manufacturing. Thin film materials are used in various electronic components and substrates, and complex shapes and graphic processes also have special production processes. PI film laser cutting or punching is a relatively widespread processing method.

PI UV cold light source is mainly used for film laser cutting or drilling because of its 35555nm wavelength characteristics. The cutting heat affected zone is particularly small to 10渭m, and the high-precision scanning vibrator has high precision and long service life, which is suitable for fine cutting and drilling of any organic/inorganic thin film materials. The functional structure of the equipment is also suitable for laser cutting of various film rolls, completing the next process, one-click processing, freeing both hands, and automatic loading and unloading.