Laser processing applications of ceramics (laser cutting, laser drilling, laser marking)

Ceramics are a functional material with high melting point, high hardness, wear resistance and oxidation resistance. It is also a good insulator in the fields of military industry, aerospace, high-end PCB, etc. It has special mechanical, optical, acoustic, electrical, magnetic and thermal characteristics, and is mainly used in ceramics in military industry, aerospace, 3C and other industries. Due to the functional characteristics and performance characteristics of ceramic materials, the breakthrough of laser technology meets the needs of ceramic processing, making it high precision, good processing effect and fast speed in the processing process, thereby increasing the difficulty of processing. The traditional processing method mainly adopts CNC machining, which is slow and low precision. This method is becoming less and less suitable because it requires higher precision. Under this premise, the continuous breakthrough of laser technology has gradually gained a say in ceramic cutting and marking.

Advantages of laser cutting and marking: The advantage of laser cutting is that the laser spot is very small, which means that the cutting accuracy is very high. Laser cutting is a non-contact processing method that does not generate stress. The contact between the traditional processing method and the material will inevitably affect the processing accuracy and efficiency, so the laser cutting efficiency is higher.

In terms of ceramic labels, the UV laser has a small focal point and the label accuracy can reach 0.2mm. The label has good visual effect, long label effect, wear resistance, no fading, clear and layered. Especially on the basis of precision labels, it has stability and advantages that other lasers cannot achieve. In the fields of machinery, chemical industry, electronics, aerospace and other technical fields, the application of ceramics has expanded from daily life and industrial production to a broad market prospect. As a ceramic processing tool, the importance of laser is self-evident. Infrared picosecond laser, narrow pulse width, high peak power, small focus, small thermal impact on cutting ceramics, no burrs, and high cutting accuracy. In terms of marking, the marking accuracy is high and the marking effect is clear.