Laser Scribing and Thin Film Scribing

Laser scribing and thin film scribing are ideal for creating fine lines and other blind features and patterns on a variety of substrates, films and coatings.

Laser scribing, which encompasses many terms including micro scribing and thin film scribing, is used to create precisely controlled fine grooves or write fine lines into thin films and coatings. Laser energy can be applied to the material in one of two ways, either focused to a small spot and scanned across the surface, or imaged through a mask to project a pattern onto the surface. The use of laser scribing allows for very precise writing of fine features on the surface of a material and by removing one or more layers in a multi-layer substrate.

By using precision laser processing, individual layers in thin film devices such as capacitors and batteries can be selectively targeted, creating a highly versatile patterning process. The laser process can be tuned to remove one deposited layer from another or from the underlying substrate, which is critical for isolated scribing processes in thin film capacitor production. By carefully selecting the laser type and process parameters, virtually any material can be scribed, including highly reflective or transparent materials.

Laser scribing and selective layer processing of precisely controlled structures can be achieved on most materials, including clear coatings on transparent substrates, such as those used in the display and photovoltaic industries. Selective laser processing also allows the removal of metal layers and coatings with little or no processing of the underlying substrate. Very fine lines can be written to create high-density circuits and functional or decorative patterns. Thin oxide layers on flexible and rigid materials can be laser scribed to define conductive and non-conductive areas.

Thin Film Laser ScribingCan also be used to modify the functional properties of coating materials, such as modifying resistance or reflectivity.