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Precision laser punching technology is one of the earliest practical laser processing technologies and one of the main application areas of laser processing. The principle of precision laser punching is to punch objects through high power density pulses and short-time heat sources. Precision laser punching technology is widely used in the processing of mobile phone products, and its process application and display can be seen from internal components to the outer shell.
Precision laser punchingTechnology is one of the earliest practical laser processing technologies and one of the main application areas of laser processing. The principle of precision laser punching is to punch objects through high-power density pulses and short-time heat sources. Precision laser punching technology is widely used in the processing of mobile phone products, and its process application and display can be seen from internal components to the outer shell.
Compared with traditional punching methods such as mechanical drilling machine process, electric spark discharge, and electrochemistry, precision laser punching process is a cutting-edge technology of the new generation of intelligent optical technology, with essential differences and advantages. For example, processing micrometer holes on high melting point or high hardness material plates, or processing micrometer deep holes on sapphire, ruby, diamond and chemical fiber material nozzles, such ultra-precision processing tasks are difficult to achieve, and even precision laser punching processes can be easily achieved.
With the continuous innovation of laser technology, high-energy density laser beams are highly concentrated in space, reducing the spot diameter to micrometer level or even smaller, to obtain highly concentrated power density, complete the punching task at the fastest speed, and can be widely used.
The main advantages of precision laser drilling technology are:
1. Fast drilling speed and high efficiency; high drilling accuracy and no deviation in positioning accuracy;
2. The punching contour is clear and three-dimensional, smooth and without burrs;
3. The heat-affected area is small, which will not cause deformation or damage to the workpiece. It is suitable for the punching process of brittle, hard and soft materials.
4. It is suitable for batch processing of large number of group holes with high density;
5. There is no extra consumables and no tool loss during use;
6. It can punch holes on irregular and difficult-to-process inclined surfaces.
The application of precision laser drilling technology in mobile phones is mainly precision cutting or microhole processing, such as mobile phone metal or non-metal parts. Common application scenarios include FPC flexible circuit board laser drilling, mobile phone Home button laser drilling, mobile phone camera/flash laser drilling, explosion-proof film/polarizer drilling, mobile phone receiver/microphone laser drilling, dustproof net laser drilling, etc.
The continuous breakthroughs and innovations in laser precision processing technology will continue to help the mobile phone and the entire 3C electronics industry develop in a diversified, lightweight and light manner.
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