Laser cutting - 15渭m PCB circuit board drilling application

Laser drilling of 15渭m diameter circuit boards (Flexibility: Precision and Speed)

As a circuit board processing expert, Leiser Laser offers customized solutions for drilling blind and through holes in rigid and flexible circuit boards. Our systems can drill high aspect ratio micro-vias with diameters up to 15渭m. As experts in trepanning or percussion drilling with ultrashort pulse lasers, we represent ideal process results for various circuit board materials such as RCC, FR4, FR5, polyamide, etc.

Laser DrillingUnrivalled Quality Levels Achieved

Whenever mechanical drilling methods have reached their limits, laser drilling should be used. Lasers can not only be used for extremely accurate drilling, but also for quality levels that were not previously achieved. In addition, laser drilling is particularly gentle. Since this is a non-contact process, there are no thermal or mechanical stresses on the material. There are no debris, because the removed material only evaporates and is completely absorbed.

Economic benefits with laser drilling.

However, with the laser drilling process, not only can drill diameters that are not achievable with cutting processes be achieved, but they can also be used very economically. Laser drilling is not only more productive and more reliable than conventional methods, but can also be easily and fully automated with solutions.

Compared with traditional drilling methods, laser drilling has the following advantages:

Cheap, Accurate and Fast

Compared with traditional drilling methods, laser technology has decisive advantages:

Non-contact process - no mechanical tool wear, no forces on the material.

Large process window combined with wear-free tools for maximum price stability at the highest quality.

Minimal thermal load - no coolant, no component damage near the laser processing.

Optional diameters (Via): minimum aperture of 15 渭m, even in difficult-to-access areas.

Low maintenance.

No damage to the surface or underlying layer.

Precision drilling without post-processing.

Maximum cleanliness - no debris or dust.

Small hole to hole distances can be achieved.

Material freedom

Design freedom

Process stability

Ultrashort Pulse Laser for Laser Drilling

1. Nowadays, ultrashort laser pulses are crucial for various materials with high aspect ratios. Short pulses enable the smallest through-holes, which means smaller electronic devices can be realized;

2. Since the early 2000s, as electronic products have become smaller and smaller, high-performance ultrashort pulse lasers have been developed, which makes new processing methods with pulses in the femtosecond and picosecond range possible;

3. Strong localization of energy input;

4. Semiconductors and insulators such as silicon, glass, sapphire and ceramics can effectively handle nonlinear absorption mechanisms;

5. No enamel deposition 6. Highest process quality due to direct evaporation and aspiration of material; 7. Low heat loss - high horizontal resolution, down to the sub-micron range; 8. Lateral dissolution is independent of heat loss; 9. No shock waves; 10. No micro cracks; 11. No delamination; 12. No significant heat input.

Leiser Laser is a leading supplier of laser machines for drilling and blind vias and for removing covering materials

1.We offer the right machine for every machining and manufacturing process. For every material and every material thickness. A wide range of laser options and different system properties enable you to find the right balance between cost and quality for your laser drilling application.

2.Laser sources: UV, green and infrared lasers with nanosecond, picosecond and femtosecond pulse durations.

3.Degree of automation: Standalone or as part of a fully integrated production line (Industry 4.0 ready), all from a single source!

4.Aperture: Microaperture >15渭m.

5. Aspect ratio (depth-to-diameter ratio): 1.5-2.

6. Materials: metal, ceramic, copper, FR4, FR4, FR5, polyamide, etc.