Market analysis of precision laser drilling processing business

Precision Laser ProcessingThe system adopts the world's leading picosecond solid laser, which fully realizes high-precision, high-efficiency, high-hardness and brittle material fine processing. It can be applied to any heat-sensitive, high-hardness and fragile material drilling, cutting, engraving processing. The core control system of the machine adopts multi-axis laser control software, supports CCD visual positioning, three-axis motion platform linkage, and also supports three-axis processing of the laser part vibration mirror scanning system.

Picosecond laser processing has a very narrow pulse width, a very high laser frequency, and an ultra-high peak power, and almost no heat conduction, so the processing has no thermal impact and stress on heat-sensitive materials. Picosecond laser processing is the most promising third-generation precision cold processing method in the laser industry and is the future development trend of the laser industry. It can be used for micro-hole drilling and fine cutting of materials such as reinforced glass, ultra-thin metal plates, ceramic substrates, and sapphire substrates. Mainstream applications include cutting of mobile phone glass covers, cutting and drilling of precision gear parts in the high-end watch industry, and circuit cutting in the semiconductor microelectronics industry.