激光切割PCB设备目前是否已经成熟了？

产品特点

高精度机床、高精度伺服丝杆传动保证位置精度和尺寸精度，更好的真圆度，更好的转角效果。

稳定的行走和能量控制使机器切割产品的边缘热影响区更小，切割效果更光滑，效果一致性好。

软件性能优越，可实现分层切割、切割路径优化、激光跟随速度等功能，切割效果一致性好，控制材料半切割能量。

激光高速精密切割用于屏幕保护膜、丙烯酸板、OCA光学胶、PET显示面板、触摸屏、FPC、PCB、电子纸、偏光片、产品标准等领域。

Due to the advantages of laser in focusing, the focusing point of thin film laser punching machine can be as small as sub-micron order of magnitude, which makes it more advantageous for micro-processing of thin films, and the cutting and drilling depth is controllable. Even at a low pulse energy level, a high energy density can be obtained, and materials can be processed effectively. Thin film laser punching machine belongs to non-contact processing, and the punching pattern can be set at will. At the same time, the machine has laser process functions such as marking, easy-tear line, solid line, dotted line, half-cut, and full-cut.

Processing advantages

1. The laser punching machine uses a high-beam quality American metal tube CO2 laser;

2. The laser punching speed is fast, and the single hole speed is as high as 150m/min;

3. The laser can operate on films of different thicknesses, with better compatibility and versatility;

4. The laser can cut some more complex patterns;

5. Laser punching does not require the replacement of blade molds, there is no problem of tool wear, and it can operate continuously for 24 hours.

The ultra-fine laser drilling method uses the beam generated by the laser to evenly cut a thin line of only a few microns deep on the designed solid line, dotted line, wavy line, and easy-tear line. Taking advantage of the laser focusing, the focusing degree can be as small as the sub-micron order of magnitude, so it has advantages in the micro-processing of materials, and the cutting, marking, scribing and drilling depths are controllable. Even at low pulse energy levels, a higher energy density can be obtained to effectively process materials. Laser equipment can be used in slitting machines or rewinding machines, and laser technology can be used for flexible packaging materials such as OPP, BOPP, PE, PET (polyester), aluminum foil, and paper.