What are the technical parameters of UV laser cutting?

Since the emergence of ultraviolet lasers, excimer lasers have dominated the application field of ultraviolet "cold processing".

However, excimer technology also has many defects: all excimer lasers contain toxic gases, and the replacement, storage and adjustment of special gases are very cumbersome.

At the same time, they are large in size, expensive, and have high operating and maintenance costs;

Not only that, the output end of the excimer laser also has problems such as large rectangle and poor spatial quality, which seriously limits the focusing of the beam, so a mask template must be used.

Excimer lasers work well for drilling holes of the same shape and repeatability in one step (such as processing the holes on the nozzles of inkjet printer drums), but are generally not very efficient, with only 1% of the pulse energy acting on the processing surface, while the other approximately 99% of the light energy is lost on the template.

In addition, the flexibility of the mask method is limited. If the pattern changes and the mask needs to be replaced, the entire processing process must be stopped.

The application of solid-state UV lasers has always been limited by insufficient output power, which cannot meet processing needs.

With the development of more reliable diode-pumped solid-state technology and more reliable frequency tripling mechanisms, the situation has changed.

The new frequency-tripled diode-pumped solid-state lasers are competitors to excimer lasers, with comparable energy density levels, but with higher repetition rates and better beam quality.

The good beam quality and excellent focusing capabilities allow you to process without masks. The beam is delivered to any position on the table by a computer-controlled scanning vibrating mirror system) and is used for drilling, scoring or cutting by direct engraving with CAD/CAM software.