What do you need to know before buying a PCB laser cutting machine?

Speaking of buying PCB laser cutting machine, the investment cost of the board separation equipment is high, and the procurement process requirements will certainly be very complicated. Compared with other PCB board separation equipment, the technical threshold of PCB laser cutting machine is higher, and more technical information needs to be referenced. For customers, these strange information seems to be very difficult to understand, so how to understand PCB laser cutting and board separation equipment, here Laisai Laser will give you some references through the explanation of this article, hoping to help you.

As a manufacturer, our first choice is to understand the needs of customers and recommend corresponding models according to their needs, such as aluminum base, epoxy resin, FR4, fiberglass board, and PCB product specifications.

1. Materials

Use the corresponding equipment according to the material recommendations, aluminum substrate. Copper substrates usually use QCW fiber laser cutting machine boards, and CO2 laser cutting boards were also used in the early days. With the advancement of technology, it has gradually replaced other materials, such as green or ultraviolet laser PCB laser cutting machines.

2. Speed and processing effect of processing products

PCB laser cutting machine can meet the requirements of flat cross section, no burr, no stress, no deformation, and can process PCB split boards containing components. However, the processing speed will affect the processing effect. The equipment recommended in this article is UV PCB laser cutting, split board machine and green light PCB laser cutting.

Using UV laser equipment, the processing effect is good, but the efficiency is low. Using green laser device, the processing effect is not as good as UV laser, but the efficiency is higher. At the same time, the greater the thickness of the plate, the lower the processing efficiency, and the worse the processing effect. There is no doubt that this is a very fast process. Even 2mm plates can be perfect as long as the speed is not taken into account. From the processing speed point of view, the better the material absorbs light, the faster the speed. For example, paper substrates of the same thickness are faster than epoxy resins. With the increase of laser power, the single pulse energy and repetition frequency increase, and the cutting speed increases.

3. Processing range and processing gap

The processing method of the PCB laser cutting machine is to scan back and forth through the vibration mirror, so there are two reference points: the vibration mirror processing area and the workbench processing area. The processing area of the galvanometer refers to the working area of a single processing, and its effective area is the effective parameter of the PCB size. Except for aluminum and copper substrates, the general laser panel splitter can be controlled within 100 microns. The thinner the thin plate, the smaller the processing gap.

4. Carbonization

The carbonization phenomenon actually reflects the processing effect. Carbonization is not the cutting surface, but the cutting section. On the one hand, carbonization is caused by the heat effect of the high-energy beam during gasification, and on the other hand, it is caused by the smoke generated during gasification adhering to the cross section.

Therefore, to solve this problem, the laser processing frequency must be increased first. Pulse energy and average power. Another way is to reduce the cutting speed, reduce carbonization, and add auxiliary dust removal devices. Of course, those customers with high requirements hope that they will not be blackened at all, but it is very inefficient and difficult to be compatible.