What role does laser cutting machine play in chip manufacturing?

Laser is one of the four great inventions of the 20th century. In addition to atomic energy, computers, and semiconductors, humans have discovered that the global laser market size reached US$15.13 billion in 2019. According to the band distribution, the longer the laser wavelength, the greater the technical difficulty, and the demand in the civilian and military fields is huge, and the market space is huge.

The development of film-making equipment and the chip industry are inseparable. With the expansion of the domestic semiconductor market, the demand for chips is also growing rapidly. In recent years, with the continuous expansion of the market share of semiconductor equipment in mainland China, the continuous expansion of production capacity, and domestic and foreign pressures, the market share of semiconductor equipment in mainland China and the scale of the global semiconductor equipment market have increased year by year. In 2020, the scale of the semiconductor equipment market in mainland China was 26.33%, an increase of 14.6% from 11.73% in 2014.

What role does the laser cutting machine play in chip manufacturing?

Laser is one of the four great inventions of the 20th century and occupies an important position in wafer processing. The chip developed by the present invention uses laser cutting as the core raw material, which fully meets the requirements of wafer cutting and can effectively avoid the problem of grinding wheel cutting.

1. Non-contact processing: Laser processing only requires the laser beam to contact the workpiece, and the cutting workpiece will not be affected by the cutting force and will not damage the surface of the processed material.

2. High processing precision and small heat impact: The instantaneous power of pulse laser is large, the energy density is high, the average power is low, the processing can be completed instantly, the heat impact range is small, the precision requirement is high, and the heating surface is small.

3. High processing efficiency and good economic benefits: The processing efficiency of laser is usually several times that of mechanical processing, and there is no consumable material and no pollution. Semiconductor wafer laser invisible cutting technology is a brand-new laser cutting technology with the advantages of fast cutting speed, no dust, no dust generation during cutting, no loss to the substrate, small cutting path, and complete drying.

Its basic principle is to focus a short pulse laser beam on the surface of the material, form a calcium layer in the middle of the material, and then separate the chip through external pressure.

In the semiconductor industry, laser cutting equipment is widely used. In recent years, laser equipment has developed rapidly in China. In recent years, domestic chip applications have shown diversified development. The demand for chips in industries such as smart phones, the Internet of Things, automotive electronics, 5G, and artificial intelligence continues to grow, and higher requirements are placed on the quality and reliability of chips. In the future, the domestic semiconductor market will bring huge development opportunities for domestic equipment.