What are the solutions for laser cutting in electronic product applications?

Laser Laser uses innovations in laser technology to develop efficient machine solutions for the production of electronics. The use of ultrashort pulse lasers ensures optimal processing results when drilling, scribing, cutting and structuring circuit board materials, ceramic substrates and semiconductor wafers.  

A galvanometer scanner or a fixed optical processing head can be combined in each machine. One machine can also cover a two-stage process.

PCB laser processing

Laser Drilling Microvias

Laser drilling of blind and through vias in rigid and flexible circuit boards. Microvias with high aspect ratios and diameters of <20 渭m. Trepanning or percussion drilling with ultrashort pulse lasers enables an ideal process for a wide range of circuit board materials.  

Typical applications: RCC, FR4, FR5, polyimide 

Laser Cutting Circuit Boards

Laser cuts outlines (routing) in rigid/flexible circuit boards and cover foils. Clean and high-precision cuts with minimal cutting widths in a variety of circuit board materials.  

Typical applications: RCC, FR4, PTFE, CEM, polyimide

Laser Depaneling

Laser cutting of assembled and unassembled circuit boards. Clean and high-precision cuts with minimal cutting widths in a variety of circuit board materials.

Typical applications: FR4, FR5, polyimide

Laser structuring of the copper cover layer of the circuit board with minimal damage to the underlying material (dielectric). Very fine structures of <10 渭m are created with high accuracy and repeatability.

Creating Cavities in Printed Circuit Boards

By using lasers to remove material in a targeted manner, cavities can be created in the circuit board for inserting microchips. The laser process allows precise control of the removal depth and the geometry of the cavity. 

Using a suitable laser source and processing strategy ensures high surface quality with minimal thermal stress on the material.  

Laser Scribing of Ceramic Substrates creates a well-defined break line in the material, enabling clean and precise separation into individual parts (separation). 

Depending on the application requirements and the selected laser source, the substrate can be processed using either fixed optics or a galvo scanner. Ultrashort pulse lasers produce burr-free score lines and reduce thermally induced material stresses through an almost cold removal process.  

 Typical materials: AlOx, AlN, DCB substrates, composite ceramics 

Laser Cutting Ceramic

Laser cutting creates any geometry with minimal radius in ceramic substrates (internal and external contours). Depending on the application requirements and the selected laser source, the substrate can be processed with fixed optics or galvo scanners. Ultrashort pulse lasers produce burr-free score lines and reduce thermally induced material stresses through an almost cold removal process.  

Typical materials: AlOx, AlN, LTCC, HTCC, DCB substrates, composite ceramics

Laser Drilling of Ceramics

Laser drilling of ceramic substrates allows for the smallest possible hole diameters (<40 渭m). Depending on the hole diameter, trephine or percussion drilling can produce the ideal hole geometry in AlOx, AlN, LTCC, HTCC, DCB substrates and composite ceramics. 

Ultrapulse lasers produce burr-free holes and reduce thermally induced material stresses through an almost cold removal process.

Creating Cavities in Ceramics

By using a laser to remove material in a targeted manner, cavities can be created in ceramic substrates, in which the microchips are inserted. The laser process allows precise control of the removal depth and the geometry of the cavity. 

The use of suitable laser sources with pulse lengths in the nanosecond and picosecond range ensures high surface quality with minimal thermal stress on the material.