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【summary】
Paper laser hollowing machine is a new processing equipment specially developed for paper products industry. Due to its unique design and high performance configuration, it greatly improves the working efficiency and becomes an indispensable equipment in paper products industry, and gradually occupies the paper products processing market .Compared with the conventional manual operation, the speed is greatly improved.
Paper laser hollowing machine is a new type of processing equipment specially developed for the paper products industry. Due to its unique design and high-performance configuration, it greatly improves work efficiency and becomes an indispensable equipment in the paper products industry, and gradually occupies the paper products processing market. Compared with conventional manual operation, the speed is greatly improved. One person operates multiple devices, reducing labor costs and saving secondary mold opening costs. One-time investment, lifelong use, you can design patterns at will, without being restricted by graphics, and one-time molding does not require secondary processing.
Laisai integrates laser technology, optical technology, precision machinery, electronic technology, and computer software technology. Laser processing is different from traditional contact processing. It uses instantaneous extremely high light energy to evaporate the surface tissue of the material or burn the local position of the material through chemical and physical effects to achieve the purpose of engraving marks on the surface of the material.
The laser hollow paper with aluminum structure controls the entire working area through transmission to achieve stable quality. This method uses two galvanometer motor drives and drives the third axis through the pre-scanning focusing system to achieve a wide range of adjustment of the focus distance.
Laiser laser die-cutting hollowing machine has distinct characteristics and outstanding effects.
Wide range of substrates
Self-adhesive paper, PET, PVC, paper, leather, wood, organic glass and other materials can easily integrate a variety of processing methods, bitmap, scribing, cutting, hollowing out at one time.
Personalization
The use of microcomputers can quickly change different processing patterns, which can not only meet the needs of personalized processing, but also meet the needs of post-press workers for small-batch short-run (digital) quick printing and imposition printing.
High Precision
Automatic laser cutting and engraving, no vibration offset, optical tracking, higher positioning accuracy, video capture positioning method, to ensure die-cutting accuracy, die-cutting accuracy up to 卤0.00mm, can be manually or fully automatically converted.
High Efficiency
Laser cutting saves the manufacturing time and installation and debugging time of traditional die cutters.
Low Cost
The process is controlled by a microcomputer, does not require the processing of tool molds, and has low maintenance costs.
The equipment has a large processing area
Within the range of 600mm脳800mm, engraving, cutting and hollowing can be achieved.
Good equipment stability
The introduction of CO2RF laser fully enclosed optical path and strict multiple protection control design ensures the overall stability of the equipment.
The equipment is easy to operate.
This software is compatible with AutoCAD, CorelDRAW, Photoshop and other software outputs, and can automatically add and edit text symbols, graphic images, barcodes, QR codes, serial numbers, etc. It also provides direct TTF font support for file formats such as PLT, PCX, DXF, BMP, JPG, etc. It combines various processing methods together: bitmap, scratching, cutting, and engraving are completed at one time, with humanized design to reduce fatigue and improve work efficiency.
Stable performance and convenient control
The laser uses a zinc selenide lens group. In addition to the 10.6um carbon dioxide laser, it can also pass 650nm visible light, which is convenient for optical path alignment and adjustment. Stable performance and simple and convenient control. In addition, the laser adopts a three-dimensional dynamic front focusing mode, with a uniform optical path, a large processing area, and strong scalability. It can be equipped with multiple laser heads as needed.
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