What are the differences between laser panel splitters for different material selections?

In the PCB industry, PCB circuit boards are divided into hard boards and soft boards according to the material and flame retardant properties. Hard boards are divided into paper substrates, composite substrates, RCC base cloths and resin copper foil RCC, ceramic substrates, aluminum substrates, copper substrates, etc. Flexible boards are mainly divided into polyester film flexible copper boards and polyimide film flexible copper boards. Different materials are selected to make PCB circuit boards according to different numbers of layers, uses, thicknesses and flame retardancy. The general understanding of laser depaneling machines for flexible circuit boards is that they use ultraviolet laser cutting machines. What are the differences between laser depaneling machines for different material selections?

Metal base: aluminum base, copper base

Aluminum base has good thermal conductivity and is widely used in LED. Data shows that 90% of the LED industry uses aluminum base. In the early days, milling cutters or molds were used to punch aluminum bases, which had low processing accuracy, large cutting gaps, and easy deformation. Therefore, more and more users began to introduce laser depaneling machines to solve these problems. Can that laser meet the requirements? It is recommended to use QCW fiber laser depaneling machines and high-power continuous fiber laser depaneling machines, which can be used for perfect cutting of aluminum bases.

Copper base is similar to aluminum base, which belongs to metal base and is mainly used in high-end automotive headlight PCB base. Similarly, copper base is recommended by Laisei Laser for high-power fiber laser depaneling machines and QCW fiber laser depaneling machines. However, copper is a highly reflective material. When selecting a laser depaneling machine, you should choose a laser that is resistant to highly reflective materials, such as SPI fiber lasers and IPG lasers. In addition, on a 1.5 mm copper substrate, the laser power requirement is relatively high, and the cost of the laser depaneling machine is also relatively high.

Ceramic substrate: alumina, zirconia, dealuminization, silicon nitride, etc.

Ceramic substrate has good insulation, thermal conductivity, soft soldering performance and high adhesion, and is widely used in high-end products such as military industry and rockets, and is often used in high-frequency circuit industry. It is recommended to use QCW fiber laser cutting machine, especially for alumina. Zirconia substrate infrared picosecond laser cutting machine, partial ultra-thin dealuminization is recommended. Drilled silicon nitride material. In addition, it should be noted that there are defects in laser cutting of aluminum substrates. For example, when processing 99% alumina, scraping slag will be produced. It is necessary to increase the power and auxiliary gas pressure to solve the problem from a process perspective. This situation was ignored when processing 96% alumina. Customers need to be clear about their material characteristics. It should also be understood that the thicker the substrate, the higher the laser power requirement. This affects the processing effect and efficiency to a certain extent.

Glass fiber cloth: FR4.FR5.PPE.PTFE.PI.BT.CE.G10.G11 board

Glass fiber cloth has the characteristics of heat insulation, fire prevention and flame retardancy. It is often used in consumer electronics industries such as mobile phone cameras, mobile phone base plates, automotive electronics, etc., and is widely used. In this kind of board market, the commonly used board separation methods include gong knife board separation, milling cutter board separation, and walking knife board separation, but with the development of PCB circuit board thinning technology, laser board separation equipment has gradually become the PCB board separation industry. So how to choose the laser board separation machine on FR4 and other glass fiber cloth? The ultraviolet laser cutting machine recommended by Laisei Laser is already a green laser cutting machine. In general, according to the requirements of board thickness, processing speed, and processing efficiency, the power and laser type used are different, but generally ultraviolet laser cutting machines use lasers above 15W, most of which are 18W.20W high-power lasers, and green laser cutting machines generally use lasers above 35W.

Paper substrate: XPC.FR1.FR2.FR3, etc.

In the laser cutting machineindustry, paper substrate is a hard plate. Under the same laser processing conditions, the processing efficiency and effect are better than other substrates. For paper substrate laser depaneling machines, Laisei Laser recommends UV laser cutting machines. Of course, if customers want to reduce the processing effect, they can choose green laser cutting machines, which have faster processing speeds.

CEM5, CEM2, CEM4, CEM1, CEM3.CEM5, etc.

Similar to glass fiber cloth, in addition to the influence of materials, it is also affected by the thickness of the laser depaneling machine and the processing effect. High-power UV laser cutting machines and green laser cutting machines are recommended.

External: RCC resin copper foil material

The processing effect of this material using a laser plate separator is not ideal. The properties of strong resin materials are different from those of copper foil materials, and the laser wavelength absorption is different. The use of a laser plate separator to process resin copper foil materials will carbonize. It is necessary to comprehensively consider the customer's own needs. Here we recommend a UV laser cutting machine, which can achieve no carbonization regardless of efficiency.

PCB circuit board laser cutting machine is a comprehensive product designed based on factors such as material, thickness, processing area, and processing efficiency. Due to the different types of lasers used, the optical structure of the PCB is also different. You should choose the appropriate laser board equipment based on your own needs and verification needs.