易开包装激光切割的市场分析

莱塞LS-TS台式系列二氧化碳激光打标机采用了先进的激光器，先进的偏振镜系统，确保了优质的打标质量和高速度输出，整个激光系统集成了工业系统、三维工作台和升降支架，二氧化碳激光打标机光束质量好，可靠性高。
适用材料和行业应用：适合一些纸质包装盒、木制品、亚力克制品、纤维板等材料的激光标识及切割应用。

莱塞激光PCB激光分板机主要用于PCB、FPC大板、小板、外观切割、轮廓切割、钻孔等加工。设备采用高性能紫外线激光源，集成高精度CCD视觉定位技术，通过自主开发的视觉激光控制软件，完美实现精密加工应用。通过调整激光功率，可以进行PCB二维码处理，实现一机两用的切割码。

设备特点：

1. 切割面光滑，无灰尘，无毛刺，可与SMT生产线对接，实现自动化生产。

2. 激光加工不会对PCB造成损坏，无应力变形、弯曲等现象。

3. 采用精密二维工作台和全闭环控制系统，自动补偿切割精度。

4. 激光PCB分板板比传统的加工模式更有优势。

Small laser die-cutting machines stand out in the modern processing industry with their unique characteristics. First of all, their most notable feature is high precision, which can achieve accurate die-cutting of tiny and complex graphics, ensure smooth product edges and precise dimensions, and meet high-precision processing requirements.

Secondly, small laser die-cutting machines have high-efficiency production capabilities. Laser technology greatly increases the die-cutting speed, while reducing the tool replacement and debugging time required for traditional die-cutting, thereby significantly improving production efficiency.

In addition, the equipment shows extremely high flexibility. It can not only process a variety of materials, such as paper, film, plastic, etc., but also easily adapt to materials of different thickness and hardness to meet diverse die-cutting needs.

Finally, the small laser die-cutting machine has a compact design, small footprint, easy installation and movement, and is particularly suitable for processing environments with limited space. At the same time, its intelligent operation interface makes the operation easier and reduces the difficulty of operation.

In summary, the small laser die-cutting machine has become an indispensable and important equipment in the modern processing industry with its high precision, high efficiency, high flexibility and compact design.