Laser drilling and laser cutting processes in ceramics

Alumina, aluminum nitride and other materials have good thermal conductivity, good insulation and high temperature resistance, and have been widely used in electronics, semiconductors and other fields. However, ceramic materials are hard and brittle, and are difficult to form and process, especially in micro-hole processing. Because lasers have high power density and good directivity, ceramic thin plates are currently generally processed with laser drills. Laser drills generally use pulsed lasers or quasi-continuous lasers (fiber lasers). The laser beam is concentrated on the workpiece placed perpendicular to the laser axis through an optical system.

Because electronic components and semiconductor components are small in size and high in density, there are high requirements for the accuracy and speed of laser drilling. According to the use requirements of the components, electronic components and semiconductor components are small in size and high in density, so there are high requirements for the accuracy and speed of laser drilling. According to the use of the components, the diameter of the micropores is between 0.04 and 0.1mm. For lasers used for precision machining of ceramics, the general laser focus diameter is 鈮?.05mm. According to the thickness and size of the ceramic plate, holes of different apertures can be achieved by controlling the focus separation amount. For holes with a diameter less than 0.15mm, the holes can be achieved by controlling the focus separation amount.

There are two main types of ceramic plate cutting: water jet cutting and laser cutting. Fiber laser is widely used for laser cutting in the market.

The advantages of ceramic laser cutting machine are:

(1) Narrow incision, high precision, small thermal interference zone, smooth incision surface without burrs.

(2) The laser cutting head does not touch the material surface or damage the workpiece.

(3) The incision is narrow, the heat interference area is small, the local deformation of the workpiece is very small, and there is no mechanical deformation.

(4) The processing is flexible and can process any graphics, and can also cut pipes and other special-shaped materials.

This is a high-end precision laser processing equipment developed mainly for the fine processing of various types of ceramics. It has excellent characteristics such as high processing efficiency, good quality, small thermal interference area, stress-free flexible processing, arbitrary graphic processing, CCD automatic focusing, positioning, automatic box-to-box loading and unloading, etc. It is an ideal tool for processing ceramic materials in thick film circuits, microwave communications and other electronic components.

With the continuous advancement of 5G construction, industrial fields such as precision microelectronics, aviation and shipbuilding have also developed further, and the application of ceramic substrates has also covered these fields. In these aspects, ceramic substrate PCBs are increasingly used due to their excellent performance.

Ceramic substrates are the basic materials for high-power electronic circuit structure technology and interconnection technology. They have a dense structure and are somewhat brittle. Conventional processing methods will cause stress during the processing of very thin ceramic sheets, which can easily cause breakage.

In recent years, with the development of miniaturization and lightweight, traditional cutting methods cannot meet the requirements due to low precision. As a non-contact processing tool, laser plays a very important role in the processing of ceramic substrates PCB.

With the continuous development of the microelectronics industry, electronic components are gradually developing in the direction of miniaturization and lightness, and the requirements for precision are getting higher and higher, which will inevitably put forward higher requirements on the processing degree of ceramic substrates. Based on this background, the application of laser ceramic substrates on PCBs has broad development prospects!