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【摘要】
In the electronics industry, FPC can be said to be the blood transfusion channel of electronic products. With the rise of various smart industry giants, the requirements for circuit board application processing are getting higher and higher.
In the electronics industry, FPC can be said to be the blood transfusion channel of electronic products. With the rise of various smart industry giants, the requirements for circuit board application processing are getting higher and higher. In the past, mobile phones only needed a thick circuit board. Now with the development of intelligence in the electronics industry, the number of layers of PCB is increasing, smaller and thinner. In addition, FPC friction plates need to be configured to accommodate more and more electronic components, and the requirements for processing accuracy are also getting higher and higher. As a non-contact processing tool, laser can concentrate on converting high energy to perform laser cutting, drilling, marking, welding, marking and other processing on materials.
Laser has three major functions in the manufacturing process of flexible circuit boards: cutting, covering, drilling, etc.
FPCThe advantages of laser cutting machine in the manufacturing process are mainly:
1.It can cut graphics of any shape, which is convenient and fast, and can greatly shorten the delivery cycle;
2.It does not increase the difficulty of processing due to complex shapes and curved paths;
3.When the cover film is opened, the edges of the cut cover film are neat, smooth, burr-free, and glue-free. The traditional mold processing method is prone to edge burrs and glue overflow after stamping.
4.The laser processing has high precision and is an ideal tool for circuit board molding; the material can be processed into any shape.
5.Ensure the verticality of the edge of the cutting surface; successfully compensate for the processing error caused by FPC deformation;
6.The processing of FPC sheets has a narrow incision and no carbonization, which effectively guarantees the product size and quality and saves material costs.
7.Because customers need to modify the line and pad position, FPC sample processing often changes the cover film window. Traditional molds need to be replaced or modified, which can be easily solved by laser processing. Just import the drawings into the system to win the opportunity to compete in the market in terms of time and cost.
8.In mass production, many small parts are stamped out using mechanical hard stamping dies. However, due to the large amount of loss and long lead time of the hard film process, it is not practical for the processing and forming of small parts.
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