继电器密封在激光焊接中的优点

PI膜阐述：

PI膜又称聚酰亚胺膜。其主要成分是聚酰亚胺，是耐高温、稳定性好的薄膜之一。PI膜是一种广泛应用于电子产品领域的薄膜。颜色通常是棕色和黑色。PI膜粘合的热熔膜类型为PA和PES热熔膜。

激光器切割PI薄膜的优点，PCB/FPC等行业各种薄膜材料的切割：

（1）进口激光，无触点切割，切割质量高，热影响区小，可以忽略。

（2）双轴单轴自由切换，方便多种物料的切割；

（3）双端同步加工，提高切割效率；

（4）全自动视觉系统，定位自动定位，切割更精确；

（5）全自动进料与收料装置，节省人力，方便快捷。

The ultra-fine laser drilling method uses the beam generated by the laser to evenly cut a thin line of only a few microns deep on the designed solid line, dotted line, wavy line, and easy-tear line. Taking advantage of the laser focusing, the focusing degree can be as small as the sub-micron order of magnitude, so it has advantages in the micro-processing of materials, and the cutting, marking, scribing and drilling depths are controllable. Even at low pulse energy levels, a higher energy density can be obtained to effectively process materials. Laser equipment can be used in slitting machines or rewinding machines, and laser technology can be used for flexible packaging materials such as OPP, BOPP, PE, PET (polyester), aluminum foil, and paper.

• 采用高性能紫外激光，高精度扫描振镜，精度高，使用寿命长；

• 高精度直线电机工作平台，精度高，速度快；
  

• 可选择CCD自动定位，自动校正；真空吸附固定板，无需替代夹具；
  

• 计算机软件在加工过程中自动控制，软件界面实时反馈，实时了解加工状态。