Laser processing of ceramic circuit boards mainly includes laser drilling and laser cutting.

Laser processing of ceramic circuit boards mainly includes laser drilling and laser cutting:

Alumina-aluminum nitride and other materials have high thermal conductivity, good insulation performance, and good high temperature resistance, and have been widely used in electronics, semiconductors and other fields. However, ceramic materials have high hardness and brittleness, and their molding and processing are very difficult, especially the processing of micro-holes. Because lasers have high power density and good directivity, laser drilling is currently widely used in ceramic thin plates. Laser ceramic drilling is generally done with pulsed lasers or quasi-continuous lasers (fiber lasers). The laser beam is focused on the workpiece placed perpendicular to the laser axis through an optical system, and a high energy density (10-10*9*cm2) laser laser beam is ejected through a laser cutting head onto the workpiece placed perpendicular to the laser axis, gradually forming a through hole.

Due to the small size and high density of electronic components and semiconductor components, high requirements are placed on the accuracy and speed of laser drilling processing. Depending on the application of components, the diameter of the micropores ranges from 0.05 to 0.2 mm. In the precision machining of ceramics, the diameter of the laser focal spot is generally 鈮?.05mm. Depending on the thickness of the ceramic sheet, through holes of different apertures can usually be achieved by controlling the defocus amount. For through holes with a diameter less than 0.15mm, drilling can be achieved by controlling the defocus amount.

Currently, there are two main methods for cutting ceramic circuit boards: water jet cutting and laser cutting. At present, the laser cutting market is more dominated by fiber lasers. Cutting ceramic circuit boards with fiber laser has the following advantages:

1. High precision, fast speed, narrow slit, small heated area, smooth cutting surface and no burrs.

2. The laser cutting head must not contact the material surface and must not scratch the workpiece.

3. The cutting slit is narrow, the heat-affected zone is small, the local deformation of the workpiece is small, and there is no mechanical deformation. /4. It has good processing flexibility and can process any shape, and can also cut pipes and other profiles.

With the continuous advancement of 5G construction, industrial fields such as precision microelectronics, aviation and shipbuilding have also made great progress, and the application of ceramic substrates has become more and more extensive. In these aspects, ceramic substrate PCBs are increasingly used due to their excellent performance.

Ceramic substrates are the basic materials for high-power electronic circuit structure technology and interconnection technology. They have a dense structure and a certain degree of brittleness. Conventional processing methods will cause stress during the processing of very thin ceramic sheets, which can easily cause breakage.

With the development trend of lightweight and miniaturization, traditional cutting processing methods have long been unable to meet the requirements due to their low precision. As a non-contact processing tool, laser plays a very important role in the processing of ceramic substrates and PCBs.