What is unique about laser cutting machine cutting PI film

PI film is a film insulation material with good performance. It is shrunk by pyromellitic anhydride (PMDA) and diaminodiphenyl ether (DDE) in a strong polar solvent and treated with imidization. Its excellent comprehensive performance and synthetic chemical diversity make it have a wide range of application prospects.

What laser equipment can be used to cut PI film?

With the development of laser technology, laser cutting of FPC and PI covering film has replaced traditional die cutting. The use of contactless laser cutting processing does not require expensive molds, greatly reducing production costs. The focus is only a dozen microns, which can meet the processing requirements of high-precision cutting and drilling, and is in line with the development trend of circuit precision. It is an ideal tool for FPC and PI film cutting.

What are the advantages of laser cutting machine cutting PI film?

Laser cutting, as a non-contact processing, can be applied to various materials and has become a top priority in the field of laser processing in recent years.

What is unique about laser cutting PI film:

It is mainly used for cutting various thin film materials in industries such as PCB/FPC. Its advantages are.

1. Imported laser, non-contact cutting, high cutting quality, small heat-affected zone, which can be ignored.

2. Single-axis and double-axis free switching, convenient for cutting various materials;

3. Double-head synchronous processing, double cutting efficiency;

4. Automatic visual system, automatically find the positioning point, cutting more accurately;

5. Automatic feeding and receiving device, saving manpower, convenient and fast.