Laser Die-cutting Technology for Electromagnetic Shielding Film

As electronic devices develop towards miniaturization and portability, assembly equipment is becoming more and more dense. Flexible circuit boards, with their small size, light weight and high line density, have gradually replaced the role of traditional wires in electronic assembly. FPC flexible circuit boards are connecting wires in electronic devices, mainly for conducting current and signal transmission. When the signal transmission line is distributed on the outermost layer of FPC, in order to avoid signal distortion during signal transmission due to electromagnetic interference, FPC is pressed into a conductive layer (electromagnetic shielding film) after the cover film is pressed, which plays a role in shielding external electromagnetic interference.

FPC is mainly used in electromagnetic shielding film. With the development of FPC industry, the electromagnetic shielding film industry has also developed rapidly. At present, FPC products (utilization rate = film area required for FPC (FPC production area) have reached about 25% of electromagnetic shielding film.

Picosecond laser cutting machineIt is suitable for electromagnetic film cutting, and can also be used for roll-to-roll, FPC soft board shape, PCB soft and hard combination board, PCB auxiliary materials and other processes, PET film, PI film, PP film, copper foil, explosion-proof film, magnetic film, Sony glue and other materials. Precision cutting.

In terms of materials, the picosecond laser cutting machine has no hot melt zone, which can realize "cold" processing; good beam quality, small focused spot; small heat-affected zone, small slit width; the cutting depth can control the cutting depth, strong processing flexibility, can realize micro-cutting, automatic loading and unloading; automatic target positioning, automatic loading and unloading, short time consumption, easy operation;

As people's expectations and requirements for electronic products continue to increase, flexible circuit boards FPC as the main carrier are also facing greater challenges. Therefore, high-frequency signal transmission and high-speed digitization are the development trends of optical fiber transmission technology.