How is the laser glass packaging process achieved?

Why use laser encapsulation glass?

Good encapsulation is the most basic requirement for obtaining stable OLED devices, and whether the integration with the panel process can reduce costs is an important consideration in deciding which encapsulation materials and equipment to use.

In this case, the development of transparent encapsulation film is particularly important for ceiling light devices, and flexible devices emphasize low-temperature processes and stress resistance.

What are the laser packaging processes

1. Deposit the frit on the cover.

2. Laser sintering.

3. Make the sealing cover.

4. Packaging diagram.

Due to its own precise sealing technology, no desiccant needs to be added, so the light output of OLED will not be affected. In addition, there is no need to etch the inner cover of the glass, which reduces the cost. However, it works for a long time within the longer process allowable range. There is still room for improvement.

For comparison, let's talk about the traditional packaging technology of OLED

OLED is a device that is extremely sensitive to water and oxygen, especially to water vapor. As long as the device is not packaged, black spots are likely to appear in the luminous area, and the black spots will increase over time. The general process of packaging includes steps such as pre-treatment of the cover, adding desiccant, applying frame glue, alignment and bonding, light curing, and re-cracking. The packaging cover is mainly divided into two types: metal cover and glass cover. Metal is easy to process and has the best water molecule barrier, thermal conductivity and electrical shielding, but it is not easy to be flat.

However, glass has the advantages of excellent chemical stability, antioxidant performance, electrical insulation, flatness and density, but its main disadvantage is low mechanical strength and brittleness. The main consideration for the glass cover is whether it is prone to microcracks. Microcracks are not easy to detect and water can easily enter. After being impacted by external forces, microcracks are easy to expand and cause the cover to break.

Method for making glass bottle cover

Although the wet etching method and hot pressing method have been developed for a long time and are also suitable for the production of metal cover plates, their process flexibility is relatively small.

The micro-sandblasting method can produce high-precision large-area and asymmetric pattern designs, but because its etching method uses particles to hit the glass, it is also the most likely to produce micro cracks.

Due to the characteristics of flexible devices, there was no way to add desiccant when encapsulating flexible devices in the past. However, this limitation was broken after Tsuruoka et al. of Japan proposed encapsulation with solution-state thin film desiccant.