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热搜词: 塑料激光焊接 激光打标机 请输入您想要了解的设备关键词……

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PCB circuit board laser drilling principle

发布人:莱塞激光 发布时间:2021-06-30 17:21:22

【摘要】

Laser drilling of circuit boards uses high-energy micro-light to irradiate and penetrate the materials on the circuit board. These materials strongly absorb high-energy lasers and convert them into heat energy, causing melting and combustion during heating, thereby forming gas dispersion and micropores. Laser drilling is a laser processing method.

线路板激光钻孔是利用高能微光照射和穿透电路板上的物质。这些物质强烈吸收高能激光,转化为热能,引起加热时的熔化和燃烧,从而形成气体分散和微孔。激光钻孔是激光加工中的激光去除,也称为蒸发加工。

PCB circuit board laser drilling principle(图1)

电路板行业中,PC打孔是FPC成型的主要工艺阶段,其质量直接影响FPC的最终性能,钻孔工艺占整个生产时间和成本的三分之一。

PCB circuit board laser drilling principle(图2)

随着电子设备向轻、薄、微、小方向发展,FPC加工也向更精密的方向发展,对大量微孔加工的需求也在增加,这也使得钻孔技术向更高的要求发展。

PCB circuit board laser drilling principle(图3)

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