PCB circuit board laser drilling principle

Circuit board laser drilling is to use high-energy micro-light to irradiate and penetrate the materials on the circuit board. These materials strongly absorb high-energy lasers, convert them into heat energy, cause melting and combustion when heated, and thus form gas dispersion and micropores. Laser drilling is laser removal in laser processing, also known as evaporation processing.

In the circuit board industry, PC punching is the main process stage of FPC forming, and its quality directly affects the final performance of FPC. The drilling process accounts for one-third of the entire production time and cost.

As electronic equipment develops towards light, thin, micro and small, FPC processing is also developing towards a more precise direction, and the demand for a large number of micro-hole processing is also increasing, which also makes the drilling technology develop towards higher requirements.