PE袋/PE膜的激光切割工艺是怎么样的

The ultra-fine laser drilling method uses the beam generated by the laser to evenly cut a thin line of only a few microns deep on the designed solid line, dotted line, wavy line, and easy-tear line. Taking advantage of the laser focusing, the focusing degree can be as small as the sub-micron order of magnitude, so it has advantages in the micro-processing of materials, and the cutting, marking, scribing and drilling depths are controllable. Even at low pulse energy levels, a higher energy density can be obtained to effectively process materials. Laser equipment can be used in slitting machines or rewinding machines, and laser technology can be used for flexible packaging materials such as OPP, BOPP, PE, PET (polyester), aluminum foil, and paper.

莱塞激光PCB激光分板机主要用于PCB、FPC大板、小板、外观切割、轮廓切割、钻孔等加工。设备采用高性能紫外线激光源，集成高精度CCD视觉定位技术，通过自主开发的视觉激光控制软件，完美实现精密加工应用。通过调整激光功率，可以进行PCB二维码处理，实现一机两用的切割码。

设备特点：

1. 切割面光滑，无灰尘，无毛刺，可与SMT生产线对接，实现自动化生产。

2. 激光加工不会对PCB造成损坏，无应力变形、弯曲等现象。

3. 采用精密二维工作台和全闭环控制系统，自动补偿切割精度。

4. 激光PCB分板板比传统的加工模式更有优势。

电容器作为常见的电子元件，在大多数电子产品中都或多或少可以使用，仔细观察电容外观，你会发现电容盒上会打标刻印一些信息图案，这些信息图案是为了防止发生意外事故、产品的追溯，所以电容胶管表面的文字信息保持清晰是对它的基本要求。