Introduction to UV laser cutting of PCB printed circuit boards

When consulting about the use of PCB laser cutting machines, many customers often ask what type of laser cutting machine is used for PCB, what size can be processed, how is the processing effect, how fast is the laser cutting of PCB, and how much is the price. Laisai Laser introduces these questions from the principle of PCB laser cutting machine, helping guests to have a preliminary understanding of the use of PCB equipment and have a preliminary understanding of subsequent samples and tests.

The materials of PCB printed circuit boards are divided into technical substrates and composite substrates, which are usually divided into copper substrates, aluminum substrates, glass fiber substrates, epoxy resins, etc. Different materials have different choices. For example, copper substrates and aluminum substrates usually use QCW or continuous infrared laser cutting machines, focusing head penetration cutting, and auxiliary gas (nitrogen, oxide, argon, air) cutting, while non-metallic materials such as glass fiber boards generally use green laser cutting machines, ultraviolet laser cutting machines, etc. Analysis of the principle of ultraviolet laser cutting PCB equipment used by Laisai Laser.

Research and Application of Laser Cutting Machine:

PCB UV Laser CuttingThe equipment uses 355 UV beams to focus a light spot smaller than 20 microns through optical devices such as beam expanders, vibrating mirrors, and focusing mirrors. The deflection of the vibrating mirror XY motor is controlled by software to make the light spot move within the scanning range of the focusing mirror. By controlling the movement of the light spot, a scan is performed within a certain range, and then a layer of the material surface is peeled off, thereby realizing the cutting of the material. However, when the material exceeds the scanning range of the lens, it is necessary to control the movement of the XY linear motor of the material placement platform for processing. Depending on the size of the material, the XY or XY platform structure can be selected. In general, the focal length of the Z-axis linear motor can be adjusted according to the thickness of the material. The focal depth of the UV laser cutting machine is relatively short, and the focal length needs to be adjusted at any time according to the processing requirements. For example, when cutting FPC flexible circuit boards and cutting 2mm hard boards, the focal length difference needs to be adjusted.

That is to say, the UV laser cutting machine is a comprehensive set of optical, mechanical, electrical and information equipment. The equipment structure consists of UV, XY linear worktable, drive device, industrial computer, high-speed lens, system control software, positioning system, dust collection system, dust collector, external light path, machine, etc.

The effect of laser cutting on PCB:

The effect of PCB in UV laser cutting is closely related to laser parameters, optical path device, processing speed and other factors. Generally, UV laser cutting machine is required to have high frequency, narrow pulse width, large single pulse energy, and high-precision device as much as possible for external light device. From the experience of Laiser Laser, laser cutting PCB usually has slight carbonization on the cutting section, but it does not affect its anti-oxidation performance. To achieve complete carbonization-free, the cutting speed must be reduced, and the cooperation of the customer is required.

UV laser cutting of printed circuit boards:

The cutting speed of UV lasers is closely related to power, material thickness, etc., and the cutting effect also needs to be taken into consideration. Generally speaking, the greater the UV power, the faster the cutting speed, and the thinner the thickness, the faster the cutting speed.

Some customers asked how long the cutting speed can cut in one second, and whether the milling cutter speed can reach 80mm/s. Here, Laisei Laser also brought you a concept. UV laser cutting PCB is not direct cutting, but scanning cutting. For example, using an 18W laser head and a 100mm lens to cut the FR4 of the laser head, the cutting speed is generally between 20-30mm/s. The specific algorithm is an estimated price. If compared, 100mm FR4 needs to be cut, scanned 30 times, using 80% of the power, cutting speed 3000mm/s, and then changed to 30mm/s for cutting. The actual cutting speed needs to be determined based on the test proofing. These speeds can only be used as a reference, not as an actual indicator. A more reasonable indicator is: calculate the processing speed based on the processing rhythm of each small piece in each batch. It is necessary to comprehensively consider the rhythm of the production line, the effect of the processing, and the cost calculation of the equipment.

PCB equipment UV laser cutting price:

The price issue has always been a commonplace issue. Our UV laser cutting machine manufacturer helps customers choose models, cooperates with customers to develop, and provides solutions. Customers need to have a budget target after inspection, and decide according to actual needs. At the same time, they must also consider issues such as service life and maintenance costs.