激光钻孔机在FPC上的应用有哪些？

PCB laser marking machine is one of the key equipment in the electronics manufacturing industry. Its unique characteristics and advantages make it an ideal choice for circuit board identification and marking. The following are its main features:

High-precision marking

PCB laser marking machine uses laser technology to achieve very fine marking. It can mark tiny text, graphics, barcodes and other information on the circuit board to ensure clear and readable marking.

High-speed processing

The laser marking machine has a fast marking speed and can complete the marking tasks of a large number of circuit boards in a short time, improve production efficiencyand shorten production cycle.

Non-contact processing

Laser marking is a non-contact processing technology that will not cause mechanical damage to the circuit board, avoiding the damage and deformation that may be caused by traditional marking methods.

Wide applicabilityPCB laser marking machine can be used for marking a variety of substrates, including FR4, metal, ceramics, etc., suitable for different types of circuit board manufacturing.

Strong flexibility

The laser marking machine can be flexibly set according to different marking requirements, including marking of text, patterns, serial numbers, dates and other information, to meet the personalized needs of different customers.

Stable marking quality

Laser marking technology has stable marking quality, clear and durable marking patterns, and is not easily affected by environmental factors, ensuring the marking quality of the product.

Energy saving and environmental protection

Laser marking is a pollution-free, exhaust-free, and noise-free processing method that meets the requirements of energy saving and environmental protection and helps enterprises achieve sustainable development.

Strong traceability

Laser marking can achieve traceability management of products, and facilitate product quality traceability and traceability by marking serial numbers, batch numbers and other information.

产品特点

高精度机床、高精度伺服丝杆传动保证位置精度和尺寸精度，更好的真圆度，更好的转角效果。

稳定的行走和能量控制使机器切割产品的边缘热影响区更小，切割效果更光滑，效果一致性好。

软件性能优越，可实现分层切割、切割路径优化、激光跟随速度等功能，切割效果一致性好，控制材料半切割能量。

激光高速精密切割用于屏幕保护膜、丙烯酸板、OCA光学胶、PET显示面板、触摸屏、FPC、PCB、电子纸、偏光片、产品标准等领域。

Small laser die-cutting machines stand out in the modern processing industry with their unique characteristics. First of all, their most notable feature is high precision, which can achieve accurate die-cutting of tiny and complex graphics, ensure smooth product edges and precise dimensions, and meet high-precision processing requirements.

Secondly, small laser die-cutting machines have high-efficiency production capabilities. Laser technology greatly increases the die-cutting speed, while reducing the tool replacement and debugging time required for traditional die-cutting, thereby significantly improving production efficiency.

In addition, the equipment shows extremely high flexibility. It can not only process a variety of materials, such as paper, film, plastic, etc., but also easily adapt to materials of different thickness and hardness to meet diverse die-cutting needs.

Finally, the small laser die-cutting machine has a compact design, small footprint, easy installation and movement, and is particularly suitable for processing environments with limited space. At the same time, its intelligent operation interface makes the operation easier and reduces the difficulty of operation.

In summary, the small laser die-cutting machine has become an indispensable and important equipment in the modern processing industry with its high precision, high efficiency, high flexibility and compact design.