Two examples in plastic laser welding

1. Microfluidic chip

This case is about the rapid production of microfluidic chips, and the substrate is a PC board. The processing process is divided into two steps.

The first step is to use laser grinding to process microchannels and drill through holes to process inlet/outlet ports. The above picture shows the details of the processed microchannels under a magnifying glass. The second step is to laser weld two PC boards together. The upper component is a transparent PC part, on which the inlet and outlet holes are processed by laser; the lower component is a colored PC part, and the microchannels are laser ground. The microfluidic chip produced by this process fully meets the pressure and sealing test requirements.

2. Microelectronics Technology

This case is the laser welding of precision components on mobile phone components.

Infrared laser and some special fixtures are used to transmit the laser beam through the upper window to the lower plastic frame. Black plastic absorbs infrared laser, forming a good molten pool, which merges with the upper window.

The weld width is only 300um (0.3mm). The welding strength is greater than the structure of the main material, that is, in the pull-out force failure test, the rupture position is on the main structure of the material.