What are the processing methods of FPCB flexible circuit boards in industrial production?

FPCB, also known as flexible printed circuit board, is a flexible circuit board belonging to printed circuit board. FPC soft board has the advantages of bending, curling and folding freely, which greatly reduces the volume of electronic products and adapts to the requirements of electronic products to develop in the direction of high density, miniaturization and high reliability. Therefore, FPC is widely used in aerospace, military, mobile communications, laptops, computer peripherals, PDA, digital cameras and other fields or products.

As an important part of various electronic and electrical products, thin FPC is composed of a variety of processes and materials. What materials are included?

Copper foil: a negative electrolytic material, a thin continuous metal foil deposited on the substrate of the circuit board, as the conductor of the PCB

PI film, full name PAM film, has excellent heat resistance and is an indispensable part of the electronic and electrical industries such as FPC (flexible printed circuit board), mobile phones, computers, and audio.

Polyester film: polyester film is a film with relatively comprehensive performance, with high toughness, excellent heat resistance and cold resistance, and is also one of the materials for printed circuit boards;

EIM electromagnetic film: EIM electromagnetic film is a vacuum sputtering method that can plate shielding materials on different substrates (PET/PC/glass, etc.);

Conductive glue: an adhesive with a certain conductivity after curing or drying, which is used to connect multiple conductive materials and form an electrical channel between the connected materials.

FRP: A code for flame-resistant material grades, which are divided into FRP reinforced plates, FRP reinforced plates, FRP laminates, epoxy plates, etc. Its adhesive sheets and inner core thin copper clad plates are important base materials for making multi-layer printed circuit boards.

3M adhesive tape: mainly used for pasting FPC 4 and FPC with a thickness of more than 0.4 mm, and the use of FPC auxiliary materials;

The above are common FPC flexible circuit board materials. In the production of cutting boards, traditional cutting methods andLaser cutting method, both methods have their own advantages and disadvantages, the traditional method is suitable for mass production, but the cost is high, the laser method is suitable for small batch production, the cost is low

Conventional FPC soft board splitting adopts stamping mode, its advantage is high processing efficiency; the disadvantage is that it causes stress damage to the FPC soft board, the production cycle is long, and the mold opening cost is high. Therefore, it is suitable for mass production for a long time, but not for small batch production, and the production process is cumbersome. The mold opening cost of FPC soft boards of different types and shapes is high and the cycle is long. Therefore, it is necessary to find a new process flow to introduce the FPC soft board splitting process.

Compared with traditional cutting methods, laser cutting does not require any pre-production, can cut various materials, non-contact processing, no tool wear, and can process parts of different shapes without changing the tool, just changing the output parameters of the laser. Use low-noise, low-vibration, and pollution-free laser cutting technology. Just import the drawings into the computer, and start processing and production with one click. There is no need for manual loading and unloading. The operation is simple, which reduces most of the labor time cost and realizes fully automated production.