What are ultrafast lasers? What are their applications?

Ultrafast laser refers to a laser with a pulse width of femtoseconds or picoseconds, which vaporizes the material instantly by relying on its own extremely high peak power. Compared with nanosecond lasers or continuous lasers, it has a smaller thermal effect and a neat processing edge, which is very suitable for cutting and processing products such as mobile phone glass screen sapphire and diamond superconducting materials!

Full screen has become a trend, and major mobile phone manufacturers such as Apple, Samsung, Huawei, and Xiaomi have launched their own full-screen products.

Full screen generally refers to the screen of the mobile phone that accounts for more than 80%, which is the inevitable result of the narrow frame. The screen of a conventional mobile phone has an aspect ratio of 16:9, is rectangular, and has right angles at all four corners. Because the front camera, ranging sensor, earpiece and other components are installed on the body, there is a certain distance between the screen and the upper and lower edges of the body. Reducing and shrinking the upper and lower borders requires redesigning the entire front part of the mobile phone, which is very difficult. Moreover, as the display area of the full-screen mobile phone is getting larger and larger, the right angle of the display area and the rounded corner of the edge of the mobile phone are getting closer and closer, and it is easy to cause damage at close distances. Therefore, in order to reduce the possibility of broken screens, it is particularly important to reserve component space and cut the screen into non-right-angle special shapes. Ultra-high-speed laser cutting has the advantages of high cutting size accuracy, no deformation of cutting seam, no burr, no taper, fast cutting speed, high cutting rate, and can realize arbitrary graphic cutting. It has obvious advantages over processing methods such as cutter wheel cutting and CNC grinding. At present, the special-shaped cutting of mobile phone full screen mainly involves L angle, C angle, R angle, and U groove cutting.

Diamond is well-deserved to be known as the "king of materials". Its hardness can be imagined. Subsequently, higher requirements are put forward for diamond processing equipment. Diamond is also a leader in superconducting materials. In high-end products, its role cannot be measured by money. Ultrafast laser plays an irreplaceable role in diamond cutting and thinning, especially in superconducting materials (as shown above). In terms of ultra-fine incision cutting and forming of 1MM thickness interface 20UM, only ultrafast laser can complete it, especially when ultrafast picosecond ultraviolet laser is processed in cold light source, there is no heat effect, the material itself will not be damaged, and the fine spot of the incision ensures that the cutting edge is neat and smooth.

The chip industry is a national heavy equipment. The development of the chip industry has become a topic of concern to every Chinese. With the improvement of terminal product functions, the requirements for chips are becoming lighter and smarter, and the requirements for chips are also getting higher and higher. Today, as the V-grooves of chips are getting smaller and smaller and the processes are becoming more mature and applied, traditional knife wheel cutting and sub-nanosecond laser cutting processes can no longer meet the needs of new production capacity. Ultrafast laser hard cutting is imperative. The Leiser laser cutting machine was born for this purpose. It uses a laser with ultrafast and ultrafine spots, and cooperates with the dedicated optical system and ultrafast beam splitter galvanometer independently developed by Leiser Laser. It can realize the simultaneous processing of 100 spots without affecting the speed. The line width is 10UM, and the perfectly smooth edge is faster than traditional cutting, saving a lot of manpower in the process.