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Application of laser cutting in copper foil, aluminum foil and titanium alloy foil

Release time:2021-05-15 15:45:47

【summary】

In the field of processing tools for ultra-thin metal materials, copper foil, stainless steel foil, titanium alloy foil, nickel alloy foil and other materials, die cutting or chemical etching is used.

In the field of ultra-thin metal materials, copper foil, stainless steel foil, titanium alloy foil, nickel alloy foil and other material processing tools, knife die cutting or chemical etching is used. With the continuous increase in demand, especially under the high standards of 5G, aerospace, satellite and other fields, the traditional process mode has gradually become weak. For example, knife die cutting will produce deformation and burr residue, affecting product performance; chemical etching processing requires screens, especially for multi-specification material processing. The number of screens required is large, which is not conducive to the processing of various products. In addition, chemical etching has serious environmental pollution, especially under the pressure of environmental protection control, more and more chemical etching processing plants have been evacuated, which has brought a lot of trouble to processing companies. Based on this premise, laser cuttingThe process method of ultra-thin metal foil has entered the relevant field, providing new ideas for the development of the industry.

Application of laser cutting in copper foil, aluminum foil and titanium alloy foil(图1)

At present, the picosecond ultraviolet laser cutting machine developed by ultra-thin metal materials exceeding laser is applied to the cutting of stainless steel foil, copper foil, nickel alloy foil, titanium alloy foil and other materials. Compared with nanosecond laser cutting equipment, picosecond laser cutting machine has obvious advantages, no burrs, deformation, low thermal impact, and carbonization degree less than 2 microns.

PicosecondLaser cutting machineIt has high flexibility and can not only cut ultra-thin metal materials, but also process the corrosion of multi-layer materials or the micro-nano flow-guiding structure on the surface of materials, such as silicon wafers, stainless steel gratings, ceramics, thin film materials, glass, etc.


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