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With the development and maturity of laser marking technology, laser marking is widely used as a means of graphic processing of products, and laser marking machines are rapidly used in the production of various industrial products that need to be marked.
Laser Marking MachineWith the development and maturity of laser marking technology, laser marking is widely used as a means of graphic processing of products, and laser marking machines are rapidly used in the production of various industrial products that need to be marked. With the continuous improvement of product quality requirements, the requirements for laser marking quality in industrial production applications are also constantly increasing, which makes the demand for online marking detection also increase day by day. The use of visual inspection systems puts forward higher requirements for the detection of laser marked products. Therefore, the research and development of laser marking and visual inspection systems has huge development potential and broad market prospects.
What we are going to talk about here is mainly to use the QUICKMARKTM laser marking machine and SRM taping machine in the production of semiconductor packaging to analyze the marking quality problems such as deformation of marking characters and incomplete marking in real-time production, as well as the influence of marking parameter settings on marking quality. The visual inspection system for laser marking uses binary image analysis to detect the quality of laser marking. After obtaining the grayscale image information of laser marking, the visual inspection system mainly uses the binary image boundary value of the visual inspection system to determine the threshold analysis related parameter settings to measure the quality of the mark, and optimize the marking process parameters and visual inspection process parameters. By discussing and analyzing the experimental results, observing and recording the actual work test conditions and comparing them with the theoretical calculation results, the reasons for the deviation are analyzed. And compared with the experimental results of predecessors, the deficiencies and shortcomings in the theoretical and experimental research of the subject are found, laying a foundation for future research. Through this study, more practical laser marking parameters and quality assessment standard parameters are established, which can provide a reliable reference for the parameter setting of the marking system of laser marking machine in the semiconductor production process, and have certain reference value for the marking and detection of text patterns on the surface of ICs in semiconductor packaging production.
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