Microfluidic industrialization solution, laser welding has absolute advantages in mass production!

Microfluidics is a technology that can precisely manipulate and control microscale fluids, especially submicron structures. In the 1980s, microfluidic technology began to rise and developed in the fields of DNA chips, chip laboratories, micro-injection, micro-thermodynamics, etc.

Microfluidic chips were originally called "chip laboratories" in the United States and "micro-integrated analysis chips" in Europe. They are the main platform for the implementation of microfluidic technology. They can integrate basic operating units such as sample preparation, reaction, separation, and detection in the biological, chemical, and medical analysis processes into a micron-sized chip to automatically complete the entire analysis process. Microflow control chips have the advantages of light volume, small amount of samples and reagents, fast reaction speed, large-scale parallel processing, and disposable. They have great potential in the fields of biology, chemistry, and medicine. In recent years, they have developed into a new research field that intersects biology, chemistry, medicine, fluids, electronics, materials, and machinery.

Why do we need to use laser welding machine for microfluidic chip bonding?

So why do we use laser to bond microfluidic control chips? Here we first need to introduce the core of instant detection - microfluidic chip. Microfluidic chip integrates a series of steps such as sample preparation, biochemical reaction, and result detection into a very small plastic-based chip. If we want to convert the reagent volume into microliter or even nanoliter or picoliter in the future, the bonding process requirements for microfluidics are very high.

However, some common ultrasonic, hot pressing and adhesive technologies have fatal flaws. For example, the disadvantage of ultrasonic technology is that it is easy to overflow and generate dust; the disadvantage of hot pressing technology is that it is easy to deform and overflow, and the production efficiency is extremely low. However, the disadvantage of adhesives is not only that adhesives are easy to contaminate the flow channel, but also that the production cost will increase due to process requirements.

Therefore, we can see the ideal degree of using laser welding for microfluidic chip bonding. Since laser welding is a non-contact welding method, an extremely fine laser beam invisible to the naked eye will be used to scan the chip during operation. The parts that need to be welded can be connected at an extremely fast speed without any impact on the flow channel. Moreover, the welding accuracy from the edge of the welding line to the flow channel is about 0.1mm. There is no vibration, noise, or dust in the entire welding process. Therefore, this extremely clean precision welding method is very ideal in the precision welding needs of medical plastic products.

This high-precision, fast, extremely clean and easy-to-operate equipment is undoubtedly the most suitable equipment for the instant testing industry. For the vigorous development of the instant detection industry in the future, I believe that the microfluidic chip laser welding machine will also become the preferred equipment for all instant detection manufacturers!

Leiser Microfluidic Laser Welding Machine

The equipment can be made according to the standard design configured according to customer needs and application scenarios. The development and design of the equipment can be changed or customized according to customer needs and application requirements.
Applicable materials: Laser beams are suitable for welding almost all thermoplastic parts and thermoplastic elastomers. Even glass fibers or various different materials can be laser welded.
Laser penetration: The optical properties of plastics are affected by crystallization, fillers, material thickness and surface structure. The near-surface layer with suitable fillers can achieve the best absorption of the laser beam. The plastic itself is transparent to the laser beam.

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