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The layer cutting process of the laser die cutting machine. In the previous two chapters, we talked about the advantages of the laser layer cutting process compared with the original processing and the principle of the layer cutting process. Today, we will talk about the laser die cutting machine and how to use it in combination with roll-shaped composite materials.
Layer cutting process of laser die-cutting machine. In the previous two chapters, we talked about the advantages of laser layer cutting process compared with original processing and the principle of layer cutting process. Today, we will talk about the laser die-cutting machine and how to use it in combination with roll-shaped composite materials.
Laser die-cutting machine is based on the requirements of specific applications. Laser layer cutting can be done in two ways: fixed laser head and mobile scanning laser head. Most of them are processed on roll-shaped composite materials, and laser layer cutting is performed along the direction of the roll-shaped composite materials. The laser is fixedly installed just above the roll format. Due to production needs, most packaging bags need to be layer-cut along the sequential direction of the roll composite material. In this case, a laser with a mobile scanning head needs to be installed to compensate for the forward speed of the roll material. The flying optical path technology can even carve out any structural shape under high-speed conditions, and can also draw a semi-circle polygonal opening structure on the edge of the packaging bag, such as a sawtooth shape.
Depending on the materials and technologies used, the layer cutting speed is generally 10~15 (ms-1), so the running speed of the roll composite material is 100-250 (m-min-1). When the laser head is fixed, the minimum layer cutting incision width is about 100渭m; when the scanning optical series is installed, the minimum layer cutting incision width is about 200渭m. Such a width is almost invisible to the naked eye, so many materials can be layer-cut. The laser power used for layer cutting is relatively small, generally 30W-100W.
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