Thin film laser drilling machine

Thinfilmlaserdrillingmachine,laserdrillingmachine

Thin film laser perforation machine has the advantage of laser focusing, and the focus point can be as small as the sub-micron level, which makes it more advantageous for micro-processing of thin films, and the cutting and drilling depth is controllable. Even at a low pulse energy level, a high energy density can be obtained, and materials can be processed effectively. Thin film laser perforation machine is a non-contact processing, and the perforation pattern can be set at will. At the same time, the machine has laser process functions such as marking, coding, easy-tear line, solid line, dotted line, half cutting, and full cutting.

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Features

Due to the advantages of laser in focusing, the focusing point of thin film laser punching machine can be as small as sub-micron order of magnitude, which makes it more advantageous for micro-processing of thin films, and the cutting and drilling depth is controllable. Even at a low pulse energy level, a high energy density can be obtained, and materials can be processed effectively. Thin film laser punching machine belongs to non-contact processing, and the punching pattern can be set at will. At the same time, the machine has laser process functions such as marking, easy-tear line, solid line, dotted line, half-cut, and full-cut.

Processing advantages

1. The laser punching machine uses a high-beam quality American metal tube CO2 laser;

2. The laser punching speed is fast, and the single hole speed is as high as 150m/min;

3. The laser can operate on films of different thicknesses, with better compatibility and versatility;

4. The laser can cut some more complex patterns;

5. Laser punching does not require the replacement of blade molds, there is no problem of tool wear, and it can operate continuously for 24 hours.